• AngelTech Online Summit
    WATCH NOW ON-DEMAND

    Want to know more?

    Connect with the compound semiconductor, photonic integrated circuits and sensors industry

AngelTech Online Summit

The health and well-being of AngelTech speakers, partners, employees and the overall community is our top priority. Due to the growing concern around the coronavirus (COVID-19), and in alignment with the best practices laid out by the CDC, WHO and other relevant entities, AngelTech decided to postpone the live event to a date later in 2020.

In the interim, we believed it was still important to connect the community and we wanted to do this via an online summit, which took place on Tuesday May 19th at 12:00 GMT and will be available for the next 6 months on demand. This will not replace the live event (we believe live face to face interaction, learning and networking can never be fully replaced by a virtual summit), it will supplement the event, add value for key players and bring the community together – digitally.

The event involved 4 breakout sessions for CS International, PIC International, Sensors International and PIC Pilot Lines.

Key elements of the online summit:

  • Covering key topics of the industries
  • Live 3 hour online summit
  • 10 minute presentations – learn from experts in the industry
  • Recorded product demos
  • Live audience questions
  • Enhanced discussion and audience interaction
  • Video panel sessions
  • Sponsors digital booth (intro video, company content, lead generator, facilitate one on one video meetings with attendees)
  • Live private video meetings between two or more attendees
  • After the live event, monthly keynotes to drive traffic to the event 24/7, 365

Innovation is in AngelTech’s DNA and we are leveraging this strength to bring you an immersive and inspiring online event without the risk of travel during this un-certain period.



Bringing together the global Compound Semiconductor Industry to learn, network, interact and create new business opportunities – digitally!

The online summit will be shorter, snappier and involve enhanced audience interaction than the flagship live event. It will not replace the live event, but provide an additional route to market in these turbulent times.

Satisfying demand for more data
Seeking new opportunities for LEDs and lasers
Ramping volumes in the power electronics sector
Enhancing the automobile
Taking wide bandgap devices to their ultimate limits

Bringing together the global Photonic Integrated Circuits Industry to learn, network, interact and create new business opportunities – digitally!

The online summit will be shorter, snappier and involve enhanced audience interaction than the flagship live event. It will not replace the live event, but provide an additional route to market in these turbulent times.

PICs Today − Datacom, Sensing & LiDAR
PIC Manufacturing − TAP, Co-Packaging & Fab
PIC Technology − Solutions, Analysis & Research
PIC ROI − Quality Metrics & Scalability
PICs Vision − Evolution and Revolution

Bringing together the global Sensors Industry to learn, network, interact and create new business opportunities – digitally!

The online summit will be shorter, snappier and involve enhanced audience interaction than the flagship live event. It will not replace the live event, but provide an additional route to market in these turbulent times.

Autonomous Transport & Delivery: LiDAR / Sonics / Digital Cameras
Healthcare & Wellness: Wearables / Portables / Fixed Diagnostics
Edge Data Analytics: AI / Machine Learning / Big Data/Digital Prototyping
Harsh Environments: Space / Aviation & Aerospace / Subsurface & Extreme Heavy Industry

Pilot Lines in photonics: the direct route to the market online summit, is organised by PIC International and supported by EPIC.

The manufacturing pilot lines enable businesses to transition from first prototypes to pilot production. There are five manufacturing pilot lines for photonic technologies addressing silicon nitride and indium phosphide PIC chips, packaging and equipment technologies, medical devices and free-form micro-optics. The Pilot lines in photonics enable companies to take their photonics-based product ideas, scale-them up, and validate them for commercial production by providing a reduced-barrier-to-entry via cost-effective pricing. The pilot lines will give SMEs easy access to advanced manufacturing services and cost-intensive infrastructures together with the expertise needed to manufacture new and innovative products.

The online summit explores how European Photonics is looking to get a head start in PIC manufacturing and optical devices and the opportunities those will bring to the industry.

About CS International

Bringing together the global Compound Semiconductor Industry to learn, network, interact and create new business opportunities – digitally!

These talks detail breakthroughs in device technology; offer insights into the current status and the evolution of compound semiconductor devices; and provide details of advances in tools and processes that will help to drive up fab yields and throughputs.

The online summit will be shorter, snappier and involve enhanced audience interaction than the flagship live event. It will not replace the live event, but provide an additional route to market in these turbulent times.

Summit Host

Chris Meadows

IQE

Platinum Partners

Gold Partners

5 Key Topics

Satisfying demand for more data
Seeking new opportunities for LEDs and lasers
Ramping volumes in the power electronics sector
Enhancing the automobile
Taking wide bandgap devices to their ultimate limits

Agenda

Tuesday 19th May 2020 starting at 12:00 GMT (13:00 BST / 14:00 CEST)
12:00 CHAIR OPENING REMARKS & INSTRUCTIONS
Seeking new opportunities for LEDs and lasers
12:05 Advanced technology of plasma dicing for GaAs VCSEL
Presented by Akihiro Itou - Panasonic
12:20 Can MicroLEDs and VCSELs revolutionize the Solid State Lighting Industry?
Presented by Pars Mukish - Yole Developpement
12:35 Compound Semiconductor Integration – Wafer Bonding towards new Di(e)mensions
Presented by Thomas Uhrmann - EV Group
12:50 Optimizing 200mm Metal Lift-off for Smaller Dimensions
Presented by Philip Greene - Ferrotec
Enhancing the automobile
13:05 Speeding On-board Charging with Automotive-qualified GaN FETs
Presented by Philip Zuk - Transphorm
13:20 Compound semiconductor adoption by automotive market
Presented by Ezgi Dogmus - Yole Développement
13:35 GaN MOCVD Solutions
Presented by Mayank Bulsara - Taiyo Nippon Sanso
Ramping volumes in the power electronics sector
13:50 Driving the revolution in wide bandgap devices
Presented by John Palmour - Wolfspeed
14:05 The SiC & GaN Power Semiconductor Market: Forecasts and Drivers
Presented by Richard Eden - Omdia
14:20 Driving the adoption of CoolGaN technology
Presented by Gerald Deboy - Infineon
14:35 Advanced Plasma Processing solutions enabling the cost down per wafer and critical device performance required to accelerate the HVM of GaN and SiC Power devices
Presented by Dr Mark Dineen - Oxford Instruments
14:50 Non-destructive dislocation and doping monitoring for GaN HEMT high volume manufacturing
Presented by Samuel Sonderegger - Attolight
15:05 CSconnected: Creating the World’s First Compound Semiconductor Cluster
Presented by Wyn Meredith - CSConnected
Satisfying demand for more data
15:20 Assessing the impact of 5G front-ends on the world' leading GaAs fabs
Presented by Eric Higham - Strategy Analytics
15:35 5G’s impact on RF Front-End: from Telecom Infrastructure to Handsets
Presented by Claire Troadec - Yole Développement
Presentation times and order are subject to change. This agenda was last updated on 06 Jul 2020 at 5:37pm.

About PIC International

Bringing together the global Photonic Integrated Circuits Industry to learn, network, interact and create new business opportunities – digitally!

The online summit will be shorter, snappier and involve enhanced audience interaction than the flagship live event. It will not replace the live event, but provide an additional route to market in these turbulent times.

Summit Host

Michael Lebby

Lightwave Logic Inc

Introductory video coming soon...

Platinum Partners

Gold Partners

5 Key Topics

PICs Today − Datacom, Sensing & LiDAR
PIC Manufacturing − TAP, Co-Packaging & Fab
PIC Technology − Solutions, Analysis & Research
PIC ROI − Quality Metrics & Scalability
PICs Vision − Evolution and Revolution

Agenda

Tuesday 19th May 2020 starting at 12:00 GMT (13:00 BST / 14:00 CEST)
12:00 CHAIR OPENING REMARKS & INSTRUCTIONS
PIC ROI − Quality Metrics & Scalability
12:05 Future and economics of PICs and PLCs in PON systems for data centre and mobile backhaul applications
Presented by Henk Bulthuis - Broadex Technologies
12:20 Building PICs the way you build software
Presented by Martin Fiers - Luceda Photonics
12:35 Assessing the long-term growth and market potential for PICs in datacom, transport and networks
Presented by Eric Higham - Strategy Analytics
PIC Manufacturing − TAP, Co-Packaging & Fab
12:50 Practical reliability guidance for PIC manufacturing
Presented by Vincent Zeng - Facebook
13:05 Scaling up photonic integration: validating designs, chips and assemblies
Presented by Iñigo Artundo - VLC Photonics
13:20 Two Paths to Economic Packaging & Test
Presented by Scott Jordan - Physik Instrumente
13:35 SiN goes thick enabling PIC applications
Presented by Michael Geiselmann - LIGENTEC
PIC Technology − Solutions, Analysis & Research
13:50 Cost-effective high-power laser-on-silicon technology for LiDAR applications
Presented by Dongjae Shin - Samsung
14:05 Innovations in fiber to chip connectivity
Presented by Scott Bickham - Corning Optical Communications
14:20 Application-Specific Design and Validation of Photonic Integrated Circuits
Presented by André Richter - VPIphotonics
14:35 PICs are more than chips
Presented by Arne Leinse - LioniX International
14:50 VTT Si-Photonic Technology on 3 μm SOI platform
Presented by Srivathsa Bhat - VTT Technical Research Centre of Finland
PICs Today − Datacom, Sensing & LiDAR
15:05 From Design to Manufacture
Presented by Remco Stoffer - Synopsys
15:20 Silicon Photonics, beyond the tipping point!
Presented by Eric Mounier - Yole Développement
15:35 Automotive, LiDAR & MedTech – Providing access & experiences gained
Presented by Arne Bentfeldt - ficonTEC
15:50 Electro-optical Substrates for High-Speed Optical Chip-Chip Communication and Sensor Applications
Presented by Felix Betschon - Vario-optics
PICs Vision − Evolution and Revolution
16:05 Integrated photonics for neuromorphic computing
Presented by Bert Offrein - IBM
Presentation times and order are subject to change. This agenda was last updated on 06 Jul 2020 at 5:37pm.

About Sensor Solutions International

Bringing together the global Sensors Industry to learn, network, interact and create new business opportunities – digitally!

The online summit will be shorter, snappier and involve enhanced audience interaction than the flagship live event. It will not replace the live event, but provide an additional route to market in these turbulent times.

Summit Host

Mark Andrews

Sensor Solutions Magazine

Introductory video coming soon...

Platinum Partners

Gold Partners

4 Key Topics

Autonomous Transport & Delivery: LiDAR / Sonics / Digital Cameras
Healthcare & Wellness: Wearables / Portables / Fixed Diagnostics
Edge Data Analytics: AI / Machine Learning / Big Data/Digital Prototyping
Harsh Environments: Space / Aviation & Aerospace / Subsurface & Extreme Heavy Industry

Agenda

Tuesday 19th May 2020 starting at 12:00 GMT (13:00 BST / 14:00 CEST)
12:00 CHAIR OPENING REMARKS & INSTRUCTIONS
Autonomous Transport & Delivery: LiDAR / Sonics / Digital Cameras
12:05 Design insights in the quest for viable automotive LiDAR’
Presented by Bill Colleran - Lumotive
12:20 Sensors for Next-Generation LiDAR Systems with High-Resolution 4D Imaging (4Di)
Presented by Bahman Hadji - ON Semiconductor
12:35 Sunshine, tunnels, bridges – the state of the art of automotive vision in difficult lighting
Presented by Ronald Müller - Vision Markets
12:50 Silicon Eats Industries, Lidar Is Next
Presented by Angus Pacala - Ouster
13:05 Lissa: 4D-True-Solid-State-Lidar
Presented by Amr Eltaher - Hybrid LIDAR
13:20 LiDAR, ADAS and the Autonomous Shuttles of Tomorrow
Presented by Heinz Oyrer - LeddarTech
13:35 All roads lead to advanced semiconductors materials or Driving Materials Technology
Presented by Mark Furlong - IQE
Edge Data Analytics: AI / Machine Learning / Big Data/Digital Prototyping
13:50 Software and AI boosting MEMS sensor technology for next generation IoT devices
Presented by Wolfgang Schmitt-Hahn - Bosch Sensortec
14:05 Cloud Engineering Simulation - A Game Changer for MEMS and Sensor Engineers
Presented by Ian Campbell - On-Scale
Healthcare & Wellness: Wearables / Portables / Fixed Diagnostics
14:20 Functional printing inks for smart sensor solutions
Presented by Stijn Gillissen - Henkel
14:35 Integrated Photonics: Enabler of disruptive innovation across the continuum-of-care
Presented by Giuseppe Coppola - Photon Delta
Harsh Environments: Space / Aviation & Aerospace / Subsurface & Extreme Heavy Industry
14:50 Ultra-high efficiency photovoltaic energy harvesting for challenging environments
Presented by Mathieu Bellanger - Lightricity
15:05 Extended temperature range Solid State Batteries for Industrial IoT
Presented by Denis Pasero - Ilika Technologies
15:20 Developments in the high-end inertial sensor market for harsh environments
Presented by Dimitrios Damianos - Yole Développement
Presentation times and order are subject to change. This agenda was last updated on 06 Jul 2020 at 5:37pm.

About PIC Pilot Lines

Pilot Lines in photonics: the direct route to the market online summit, is organised by PIC International and supported by EPIC.

The manufacturing pilot lines enable businesses to transition from first prototypes to pilot production. There are five manufacturing pilot lines for photonic technologies addressing silicon nitride and indium phosphide PIC chips, packaging and equipment technologies, medical devices and free-form micro-optics. The Pilot lines in photonics enable companies to take their photonics-based product ideas, scale-them up, and validate them for commercial production by providing a reduced-barrier-to-entry via cost-effective pricing. The pilot lines will give SMEs easy access to advanced manufacturing services and cost-intensive infrastructures together with the expertise needed to manufacture new and innovative products.

The online summit explores how European Photonics is looking to get a head start in PIC manufacturing and optical devices and the opportunities those will bring to the industry.

Summit Host

Jose Pozo

EPIC

Introductory video coming soon...

Platinum Partners

Agenda

Tuesday 19th May 2020 starting at 12:00 GMT (13:00 BST / 14:00 CEST)
12:00 CHAIR OPENING REMARKS & INSTRUCTIONS
Theme Name TBC
12:05 KEYNOTE 1 - PICking winners! European photonics and PIC pilot lines – a success story
Presented by John Magan - European Commission
12:20 KEYNOTE 2 - Setting up a legal and IP framework for photonics consortiums and SMEs
Presented by Robert Harrison - 24IP Law Group
12:35 Platinum Partner Presentation 1 - Photonics Manufacturing and Pilot Lines in the Era of the Coronavirus
Presented by Scott Jordan - Physik Instrumente
12:50 Engaging in PIC design
Presented by Pieter Dumon - Luceda Photonics
13:05 JePPIX pilot line for indium phosphide integrated photonics
Presented by Kevin Williams - JePPIX
13:20 Pilot Line - Medphab
Presented by Robin de Bruijn - Philips
13:35 Pilot Line - PHABULOUS: A new era for freeform micro-optics
Presented by Rolando Ferrini - PHABULOμS
13:50 Pilot Line - MIRPHAB
Presented by Sergio Nicoletti - MIRPHAB
14:05 Packaging & Integration Challenges for Photonic Integrated Circuits – from Research to Pilot Scale Manufacturing
Presented by Peter O'Brien - PIXAPP
14:20 Pilot Line - PIX4life - the European Photonics pilot line for life science applications
Presented by Romano Hoofman - imec
14:35 Commercial InP PIC Foundry Line
Presented by Gloria Hoefler - Infinera
14:50 User Presentation 1 - Possibilities of thick film silicon nitride
Presented by Michael Geiselmann - LIGENTEC
15:05 User Presentation 2 - Key building block development in pilot line partners – a bridge for advanced “R” & fast “D”
Presented by Thomas Van Vaerenbergh - Hewlett Packard Enterprise
15:20 User Presentation 3 - PICturizing transceivers
Presented by António Teixeira - PICadvanced
Presentation times and order are subject to change. This agenda was last updated on 06 Jul 2020 at 5:37pm.

Speakers Include

Become an Event Partner

Package Features
10 Minute Presentation Opportunity
Logo featured on:
  • Email Marketing
  • Website
  • Press Releases
  • Digital CS + PIC Magazines
  • Digital Event Signage
  • Event Platform
Online sponsor portal, your digital booth, giving you 6 months exposure:
  • Intro video and other video uploads
  • Presentation uploads
  • Content (news, press releases, white papers)
  • Ask a question / Live chat allowing you to connect with delegates
Attendee list
Access to presentations
Unlimited staff registrations
 
 
Platinum Partner
10 Minute Presentation Opportunity
 
 
 
Logo featured on Email Marketing, Website, Press Releases, Digital CS + PIC Magazines, Digital Event Signage, Event Platform
 
 
 
 
 
 
Online sponsor portal, your digital booth, giving you 6 months exposure via Intro video and other video uploads, Presentation uploads, Content (news, press releases, white papers) and Ask a question / Live chat allowing you to connect with delegates
 
 
 
Attendee list
Access to presentations
Unlimited staff registrations
2995
Gold Partner
10 Minute Presentation Opportunity
 
 
 
Logo featured on Email Marketing, Website, Press Releases, Digital CS + PIC Magazines, Digital Event Signage, Event Platform
 
 
 
 
 
 
Online sponsor portal, your digital booth, giving you 6 months exposure via Intro video and other video uploads, Presentation uploads, Content (news, press releases, white papers) and Ask a question / Live chat allowing you to connect with delegates
 
 
 
Attendee list
Access to presentations
Unlimited staff registrations
1495