Following on from the successful virtual AngelTech Online Summit`s in May and November 2020, we are delighted to announce AngelTech Live III, taking place on 12 April 2021. AngelTech will once again consist of our established events of CS International and PIC International. We are also launching a brand new virtual event, Silicon Semiconductor (SiS) International. This is not a replacement for the in-person events (we believe live face to face interaction, learning and networking can never be fully replaced digitally), it is designed to be complementary to it - to bring the industry together virtually and online to help deal with the unprecedented challenges we all currently face.
The 3rd virtual summit will utilise our enhanced event engine, integrating presentations, digital sponsors booths and the networking tools into one portal – allowing for live chat between delegates, speakers and sponsors.
Innovation is in AngelTech’s DNA and we are leveraging this strength to bring you an immersive and inspiring online event without the risk of travel during this uncertain period.
The event will take the form of three interactive sessions over 1 day and will be a must attend live summit.
Key elements of the online summit:
Innovation is in AngelTech’s DNA and we are leveraging this strength to bring you an immersive and inspiring online event without the risk of travel during this uncertain period.
BECOME AN EVENT PARTNER REGISTER TO ATTENDMany businesses have struggled throughout this pandemic, but there are a few notable exceptions. The spread of Covid-19 has accelerated on-line shopping and the shipment of PPE, and within our industry it’s not been a disaster for all sectors. Sales of UVC LEDs, which kill Covid, are rocketing, and the manufacture of SiC substrates and devices is accelerating, thanks to recent investment in the electric vehicle sector. Even those chipmakers that rely on smartphone sales have not fared too badly, despite a fall in volumes in the first half of last year, thanks to the uptake of 5G and Wi-Fi 6 providing a lucrative opportunity for producers of GaAs power amplifiers.
At the third on-line Compound Semiconductor Summit we shall consider all these markets and more. We shall assess what the future holds for our industry, while evaluating what new devices can do and where their applications lie. Despite the pandemic, this conference will testify that we continue to innovate, drive our technology forward and launch a wide variety of new products.
On the optoelectronics front, Osram will discuss its powerful portfolio of UVC LEDs, while Saphlux will talk about the use of quantum dots for colour conversion in microLEDs. The Summit will also feature a presentation from Vector Photonics on a new class of laser – the PCSEL – that combines the best virtues of the VCSEL with the attributes of edge-emitting laser. Infrared sensors will also feature, thanks to a presentation from Brolis Semiconductor.
Comprehensive coverage of RF and power devices will also be provided at our on-line conference. Qorvo will outline its successes in increasing bandwidth for 5G communication, and Integra will champion the benefits of increasing the voltage of GaN HEMTs. Sales of wide bandgap power devices are on the up, and putting numbers to these trends, alongside much insight, will be Richard Eden from Omdia.
Materials technology is also high on our agenda. IBM will discuss its technology for combing III-Vs with silicon to advance photonic circuits; evatec will details advances in PVD technology for the metallisation of GaN devices; Kyma will provide an overview of its progress in wide bandgap material technologies; and Markus Pristovek, from Nagoya University, will talk about the development of a new nitride, AlPN.
With much on offer to everyone, make sure your register for the third on-line summit.
Evatec
PVD Technology for Effective GaN device Metallization
Brolis Sensor Technology
Antimonides: promising a sensing revolution
IQE
VCSELs on large area Germanium substrates for volume manufacture
IBM
Monolithic hybrid III-V/Si photonic devices on silicon
Integra Technologies
Disrupting the tubes market with high-voltage GaN HEMTs
Nagoya University
AlPN on GaN: Extending the III-Nitride Semiconductor Family
IQE
CHAIR - CS International
Saphlux
NPQD Color Conversion Technology for Mini/Micro-LEDs
Vector Photonics
The first measurement of an all-semiconductor PCSEL predicts unprecedented speeds
Qorvo
5G Innovation for the Mobile Data Pyramid
Kymatech
Gallium Nitride Epitaxy for Power Electronics Devices
OSRAM Opto Semiconductors
Germicidal Radiation from UV-C LEDs – The first applications to address and the building blocks for the future
Omdia
The Silicon Carbide and Gallium Nitride power semiconductor market: forecasts and key players
CEA-Leti
Emerging technologies for a digital society
STMicroelectronics
Getting GaN off to a good start
EV Group
MicroLED integration by wafer bonding
EV Group
Interview with Markus Wimplinger, EVG’s head of technology development, on Heterogeneous Integration
Yole Développement
COVID-19’s pandemic - The spark for UVC LEDs’ market ramp-up!
Alterphasic
Alterphasic substrates for wide band gap semiconductors growth
Samsung
Bringing light deep down to DRAM
Rockley Photonics
CHAIR - SiS International
Intel
Co-packaging of silicon photonics based optical engines for next generation Ethernet switches and other optical I/O applications
Picosun
Low temperature ALD Al2O3 and SiO2 process results from PICOSUN® Sprinter fast batch ALD tool for 300 mm wafers
IMEC
From Design to System-Technology Co-Optimization for CMOS
Micron
3D-NAND cell challenges to enable high density and high performance devices
Okmetic
Advanced Si wafers enabling design freedom for MEMS and RF applications
ACM Research
Wet Process Challenges and Applications
EV Group
Digitally Driven Maskless Lithography Optimized for Heterogeneous Integration & Rapid Prototyping
Yole Développement
Quantum applications : beyond Si technology ?
Optiwave
Enhancing EPDA tools with SPICE native optical models
LIGENTEC
Low loss PICs that make an impact
EPIC
CHAIR - PIC International
Lightwave Logic Inc
CHAIR - PIC International
EPIC
CHAIR - PIC International
LioniX
The benefits of Silicon Nitride Integrated Photonics
Lumentum
Advanced VCSEL PIC technology and applications
Lumiphase
Pockels-enhanced silicon photonics
PICAdvanced
Photonic integrated platform for enabling 5G mass deployment.
Ayar Labs
Optical I/O for Next-Generation Computing Systems
VPIphotonics
Fabrication tolerance-aware schematic-driven PIC design
imec
Unleashing the power of silicon nitride photonics
Scantinel Photonics
Solid-state 1550nm FMCW LiDAR. How photonic integration enables the next generation LiDAR
Teem Photonics
The ioNext PIC platform: simplicity is elegance
Lightwave Logic Inc
Polymers for Fiber Optic Communications: What does the Integrated Photonics Roadmap Say?
EV Group
Utilizing Nanoimprint Lithography for Photonic Integration
VLC Photonics
Photonic integration testing: challenges and solutions
Innolume
Quantum Dots based lasers for uncooled operation.
Monday 12th April 2021 starting at 09:00 BST | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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Monday 12th April 2021 starting at 09:00 BST | ||||||||||||||||||||||||||||||||||||
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