Chair

Chris Meadows
Head of Open Innovation
IQE

Bucking the trend

Many businesses have struggled throughout this pandemic, but there are a few notable exceptions. The spread of Covid-19 has accelerated on-line shopping and the shipment of PPE, and within our industry it’s not been a disaster for all sectors. Sales of UVC LEDs, which kill Covid, are rocketing, and the manufacture of SiC substrates and devices is accelerating, thanks to recent investment in the electric vehicle sector. Even those chipmakers that rely on smartphone sales have not fared too badly, despite a fall in volumes in the first half of last year, thanks to the uptake of 5G and Wi-Fi 6 providing a lucrative opportunity for producers of GaAs power amplifiers.

At the third on-line Compound Semiconductor Summit we shall consider all these markets and more. We shall assess what the future holds for our industry, while evaluating what new devices can do and where their applications lie. Despite the pandemic, this conference will testify that we continue to innovate, drive our technology forward and launch a wide variety of new products.

On the optoelectronics front, Osram will discuss its powerful portfolio of UVC LEDs, while Saphlux will talk about the use of quantum dots for colour conversion in microLEDs. The Summit will also feature a presentation from Vector Photonics on a new class of laser – the PCSEL – that combines the best virtues of the VCSEL with the attributes of edge-emitting laser. Infrared sensors will also feature, thanks to a presentation from Brolis Semiconductor.

Comprehensive coverage of RF and power devices will also be provided at our on-line conference. Qorvo will outline its successes in increasing bandwidth for 5G communication, and Integra will champion the benefits of increasing the voltage of GaN HEMTs. Sales of wide bandgap power devices are on the up, and putting numbers to these trends, alongside much insight, will be Richard Eden from Omdia.

Materials technology is also high on our agenda. IBM will discuss its technology for combing III-Vs with silicon to advance photonic circuits; evatec will details advances in PVD technology for the metallisation of GaN devices; Kyma will provide an overview of its progress in wide bandgap material technologies; and Markus Pristovek, from Nagoya University, will talk about the development of a new nitride, AlPN.

With much on offer to everyone, make sure your register for the third on-line summit.

Chair

Howard Rupprecht
Director of Strategic Development (Europe)
Rockley Photonics

The Road to the Future is Paved in Silicon

Successfully meeting demands for critical, Silicon based products in 2020 amidst a global pandemic demonstrated the resilience and innovation of semiconductor manufacturers as never before. Despite hurricane-force headwinds, sales of Silicon devices and manufacturing equipment set 2020 records with continuing growth forecast for 2021. Why has Silicon semiconductor technology proven so essential? Silicon is the beating heart of the logic and memory chips that enable everything from medical diagnostic and treatment tools to computers, smartphones, transportation, food production and manufacturing—in short, it is foundational to our 21st century world; it is the road we will travel to the future.

Silicon devices have been and will remain crucial to everything from distance learning to workplace automation. SEMI and other international trade groups expect single-digit chip sales increases and double-digit growth for manufacturing equipment. Where do opportunities lie for designers, developers and manufacturers? What technologies are leading the charge to deliver greater performance and lower costs? How will emerging technologies extend performance gains while supporting vital applications such as AI and machine learning?

Attend Angeltech LIVE III to gain a deeper and practical understanding of ways that Silicon technology continues to evolve. The event will explore the opportunities and challenges, the risks and rewards to be had in 2021 and beyond. Examine critical back-end technologies and processes that will be key to next generation modules, systems and displays. Dive into ways that front-end processes and technologies are rapidly evolving to achieve new performance benchmarks. Gain insight into the future of semiconductors as we explore non-Von Neumann technologies including quantum and neuromorphic computing along with new front- and back-end processes.

The Sessions

BEOL – Back End of Line:
According to the SEMI trade group, outsized demand drove the assembly and packaging segment to grow 20 percent in 2020. This segment will see continued growth in 2021 along with the test equipment market. We will explore how 5G and high-performance computing will impact growth prospects and ways manufacturers can strengthen their positions within existing and emerging TAP segments.

FEOL – Front End of Line:
The wafer fab segment, including wafer processing, fab facilities, lithography and related mask/reticle equipment, saw 15 percent growth in 2020. The FEOL is forecast by SEMI to experience sustained, healthy growth in 2021 and beyond. Achieving growth will depend on innovation by existing technologies and new tech that enables greater performance at lower costs. Discover ways that foundry and logic segments can be highpoints of 2021 and how next-generation lithography will take us to 3nm nodes and beyond.

Future Insights:
SEMI, the SIA and other leading trade groups forecast continuing investment in Silicon technologies underpinning post-pandemic recovery and future economic expansion. Explore the leading candidates to replace or augment classical Von Neumann compute architectures. Delve into enabling technologies that could make quantum computing the new norm and ways that neuromorphic computing researchers envision a technological paradigm shift. Can a boundless future await the Silicon industry? Silicon titans including TSMC are saying ‘yes’ by increasing capital investment by 60 percent. Make certain your company has a role in the future of life sciences technology, transportation, communication, defense, energy, ducation and much more.

Chairs

Michael Lebby
CEO
Lightwave Logic

Jose Pozo
Director of Technology & Innovation
EPIC

Ana Gonzalez
R & D Manager
EPIC

Photonics integration will become the future engine many of our products in the next decade

The drive to miniaturization, battery power, high speed, sensing, imaging, and advanced computational processing means that photonic integration will grow, and grow quickly. Cramming discrete, individual components in a small box is going away, in fact, just like lots of transistors in an IC. Integration is key, and with photonics, there are a number of engineering challenges that need to be addressed that range from efficiently working with light, to driving high speed data with very low power consumption.

This years Angeltech LIVE III is the place to be to make sure you are calibrated and knowledgable in the latest work, advancements, and designs in the field of PICs - photonic integrated circuits.

The Sessions

While PIC based photonic integration technologies have grown on the back of optical communications, fiber optics, telecommunications, data communications even datacenters and high performance computing, this is only the beginning.

There are now many applications for PICs that go beyond just sending data quickly, with low power, and high integrity: These LIVE III sessions will gather indepth analysis of new growing arenas such as AI, automotive/LIDAR, sensing, bio-medical, industrial, consumer and many others. The expectation is that these new arenas will grow very quickly as they also require miniaturization, low power, high speeds, and of course batter power for portability.

From a technology standpoint, photonics integration has fostered incumbent technologies such as Indium Phosphide and Silicon Photonics, but as the demands on these technologies grow in terms of performance, we are now seeing GaAs take a role with integrated laser arrays for structured light sensing, LIDAR etc. We are also seeing new materials grow in interest such as glass, EO polymers, plasmonics, dielectric materials such as SiN being utilized in exciting new applications.

Key topics include

• PIC Opportunities – Datacom, Sensing & LiDAR
• PIC Manufacturing – TAP, Co-Packaging & Fab
• PIC Technology Platforms
• PIC Applications