• AngelTech Virtual Live III
    12 April 2021

    Main Event: 12 April 2021 - 10am BST (British Summer Time)

    China Recorded Event: 14 April 2021 - 10am CTT (China Taiwan Time)

    Pacific Recorded Event: 16 April 2021 - 10am PST (Pacific Standard Time)

AngelTech Virtual Live III

Following on from the successful virtual AngelTech Online Summit`s in May and November 2020, we are delighted to announce AngelTech Live III, taking place on 12 April 2021. AngelTech will once again consist of our established events of CS International and PIC International. We are also launching a brand new virtual event, Silicon Semiconductor (SiS) International. This is not a replacement for the in-person events (we believe live face to face interaction, learning and networking can never be fully replaced digitally), it is designed to be complementary to it - to bring the industry together virtually and online to help deal with the unprecedented challenges we all currently face.

The 3rd virtual summit will utilise our enhanced event engine, integrating presentations, digital sponsors booths and the networking tools into one portal – allowing for live chat between delegates, speakers and sponsors.

Innovation is in AngelTech’s DNA and we are leveraging this strength to bring you an immersive and inspiring online event without the risk of travel during this uncertain period.

The event will take the form of three interactive sessions over 1 day and will be a must attend live summit.

Key elements of the online summit:

  • Covering key topics of the industries
  • 3 interactive sessions over 1 day
  • 10 minute presentations – learn from experts in the industry
  • Recorded product demos
  • Live audience questions
  • Enhanced discussion and audience interaction
  • Video panel sessions
  • Sponsors digital booth (intro video, company content, lead generator)
  • After the live event, monthly keynotes to drive traffic to the event 24/7, 365

Innovation is in AngelTech’s DNA and we are leveraging this strength to bring you an immersive and inspiring online event without the risk of travel during this uncertain period.

BECOME AN EVENT PARTNER REGISTER TO ATTEND

Chair

Chris Meadows
Head of Open Innovation
IQE

Bucking the trend

Many businesses have struggled throughout this pandemic, but there are a few notable exceptions. The spread of Covid-19 has accelerated on-line shopping and the shipment of PPE, and within our industry it’s not been a disaster for all sectors. Sales of UVC LEDs, which kill Covid, are rocketing, and the manufacture of SiC substrates and devices is accelerating, thanks to recent investment in the electric vehicle sector. Even those chipmakers that rely on smartphone sales have not fared too badly, despite a fall in volumes in the first half of last year, thanks to the uptake of 5G and Wi-Fi 6 providing a lucrative opportunity for producers of GaAs power amplifiers.

At the third on-line Compound Semiconductor Summit we shall consider all these markets and more. We shall assess what the future holds for our industry, while evaluating what new devices can do and where their applications lie. Despite the pandemic, this conference will testify that we continue to innovate, drive our technology forward and launch a wide variety of new products.

On the optoelectronics front, Osram will discuss its powerful portfolio of UVC LEDs, while Saphlux will talk about the use of quantum dots for colour conversion in microLEDs. The Summit will also feature a presentation from Vector Photonics on a new class of laser – the PCSEL – that combines the best virtues of the VCSEL with the attributes of edge-emitting laser. Infrared sensors will also feature, thanks to a presentation from Brolis Semiconductor.

Comprehensive coverage of RF and power devices will also be provided at our on-line conference. Qorvo will outline its successes in increasing bandwidth for 5G communication, and Integra will champion the benefits of increasing the voltage of GaN HEMTs. Sales of wide bandgap power devices are on the up, and putting numbers to these trends, alongside much insight, will be Richard Eden from Omdia.

Materials technology is also high on our agenda. IBM will discuss its technology for combing III-Vs with silicon to advance photonic circuits; evatec will details advances in PVD technology for the metallisation of GaN devices; Kyma will provide an overview of its progress in wide bandgap material technologies; and Markus Pristovek, from Nagoya University, will talk about the development of a new nitride, AlPN.

With much on offer to everyone, make sure your register for the third on-line summit.

The 3rd virtual summit will utilise the ‘Connect’ Event Platform, integrating presentations, digital sponsors booths and networking tools into one portal – allowing for live text and video chat between delegates, speakers and sponsors.

Speakers

Evatec

PVD Technology for Effective GaN device Metallization

Clemens Nyffeler

Brolis Sensor Technology

Antimonides: promising a sensing revolution

Kristijonas Vizbaras, Co-Founder

IQE

VCSELs on large area Germanium substrates for volume manufacture

Andrew Johnson, Solar Business Unit Leader, PV Technology Director

IBM

Monolithic hybrid III-V/Si photonic devices on silicon

Kirsten Moselund, Research Staff Member and manager of the Materials Integration and Nanoscale Devices group

Integra Technologies

Disrupting the tubes market with high-voltage GaN HEMTs

Gabriele Formicone, Director of Technology and Innovation

Nagoya University

AlPN on GaN: Extending the III-Nitride Semiconductor Family

Markus Pristovsek, Designated Professor at IMaSS, Nagoya University

IQE

CHAIR - CS International

Chris Meadows, Head of Open Innovation

Saphlux

NPQD Color Conversion Technology for Mini/Micro-LEDs

Chen Chen, Co-Founder & CEO

Vector Photonics

The first measurement of an all-semiconductor PCSEL predicts unprecedented speeds

David Childs, Director of Product Development and Co-Inventor

Qorvo

5G Innovation for the Mobile Data Pyramid

Ben Thomas, Director of Mobile 5G Business Development

Kymatech

Gallium Nitride Epitaxy for Power Electronics Devices

Heather Splawn, President & CEO

OSRAM Opto Semiconductors

Germicidal Radiation from UV-C LEDs – The first applications to address and the building blocks for the future

Alexander Wilm, Senior Key Expert, Application Engineering

Omdia

The Silicon Carbide and Gallium Nitride power semiconductor market: forecasts and key players

Richard Eden

CEA-Leti

Emerging technologies for a digital society

Jean-Rene Lèquepeys, Deputy Director

STMicroelectronics

Getting GaN off to a good start

Filippo Di Giovanni, Strategic Marketing, Innovation and Key Programs Manager

EV Group

MicroLED integration by wafer bonding

Venkata Mokkapati, Business Development Manager

EV Group

Interview with Markus Wimplinger, EVG’s head of technology development, on Heterogeneous Integration

Markus Wimplinger, Director, BU, Technology Development and Intellectual Property

Yole Développement

COVID-19’s pandemic - The spark for UVC LEDs’ market ramp-up!

Pars Mukish, Business Unit Manager, Solid-State Lighting & Display at Yole Développement

Alterphasic

Alterphasic substrates for wide band gap semiconductors growth

Alexey Redkov, Senior Researcher

Samsung

Bringing light deep down to DRAM

Dongjae Shin, Principal Researcher

Rockley Photonics

CHAIR - SiS International

Howard Rupprecht, Director of Strategic Development (Europe)

Intel

Co-packaging of silicon photonics based optical engines for next generation Ethernet switches and other optical I/O applications

Priyanka Dobriyal, Technical Program Manager

Picosun

Low temperature ALD Al2O3 and SiO2 process results from PICOSUN® Sprinter fast batch ALD tool for 300 mm wafers

Tom Blomberg, Technology Manager / R&D Leader Picosun Group

IMEC

From Design to System-Technology Co-Optimization for CMOS

Geert Hellings, Program Manager of Logic Insite Program

Micron

3D-NAND cell challenges to enable high density and high performance devices

Tecla Ghilardi, Distinguished Member of Technical Staff, NAND Cell Engineering

Okmetic

Advanced Si wafers enabling design freedom for MEMS and RF applications

Jim Reed, VP, North America, Sales

ACM Research

Wet Process Challenges and Applications

David Wang, CEO & President

EV Group

Digitally Driven Maskless Lithography Optimized for Heterogeneous Integration & Rapid Prototyping

Bozena Matuskova, Business Development Manager

Yole Développement

Quantum applications : beyond Si technology ?

Eric Mounier, Fellow Analyst

Optiwave

Enhancing EPDA tools with SPICE native optical models

Cem Bonfil, Product Manager, Optoelectronics

LIGENTEC

Low loss PICs that make an impact

Michael Geiselmann, Co-founder and Managing Director

EPIC

CHAIR - PIC International

Ana Gonzalez, R & D Manager

Lightwave Logic Inc

CHAIR - PIC International

Michael Lebby, CEO

EPIC

CHAIR - PIC International

Jose Pozo, Director of Technology and Innovation

LioniX

The benefits of Silicon Nitride Integrated Photonics

Douwe Geuzebroek, VP Marketing & Sales

Lumentum

Advanced VCSEL PIC technology and applications

David Cheskis, 3D Sensing Product Line Director

Lumiphase

Pockels-enhanced silicon photonics

Stefan Abel, Co-CEO

PICAdvanced

Photonic integrated platform for enabling 5G mass deployment.

Francisco Rodrigues

Ayar Labs

Optical I/O for Next-Generation Computing Systems

Mark Wade, President, CTO, and Co-Founder

VPIphotonics

Fabrication tolerance-aware schematic-driven PIC design

André Richter, General Manager

imec

Unleashing the power of silicon nitride photonics

Amin Abbasi, Business Development Manager

Scantinel Photonics

Solid-state 1550nm FMCW LiDAR. How photonic integration enables the next generation LiDAR

Davide Canavesi, Business Development Manager

Teem Photonics

The ioNext PIC platform: simplicity is elegance

Adrien Billat, Sales and Application Manager - ioNext

Lightwave Logic Inc

Polymers for Fiber Optic Communications: What does the Integrated Photonics Roadmap Say?

Michael Lebby, CEO

EV Group

Utilizing Nanoimprint Lithography for Photonic Integration

Martin Eibelhuber, Deputy Head of Business Development

VLC Photonics

Photonic integration testing: challenges and solutions

Jose Galan, Sales & Marketing Manager

Innolume

Quantum Dots based lasers for uncooled operation.

Alexey Shkolnik, Director, Business Development

Agenda

Monday 12th April 2021 starting at 09:00 BST
09:00 Exhibition Opens and Live Networking Room
10:00 Opening Remarks - Dr Chris Meadows, IQE
10:05 Interview with Markus Wimplinger, EVG’s head of technology development, on Heterogeneous Integration
Presented by Markus Wimplinger - EV Group
10:25 AlPN on GaN: Extending the III-Nitride Semiconductor Family
Presented by Markus Pristovsek - Nagoya University
10:40 Antimonides: promising a sensing revolution
Presented by Kristijonas Vizbaras - Brolis Sensor Technology
11:00 Monolithic hybrid III-V/Si photonic devices on silicon
Presented by Kirsten Moselund - IBM
11:15 Getting GaN off to a good start
Presented by Filippo Di Giovanni - STMicroelectronics
11:30 Alterphasic substrates for wide band gap semiconductors growth
Presented by Alexey Redkov - Alterphasic
11:45 SESSIONS BREAK
12:25 Emerging technologies for a digital society
Presented by Jean-Rene Lèquepeys - CEA-Leti
12:40 The Silicon Carbide and Gallium Nitride power semiconductor market: forecasts and key players
Presented by Richard Eden - Omdia
12:55 The first measurement of an all-semiconductor PCSEL predicts unprecedented speeds
Presented by David Childs - Vector Photonics
13:10 MicroLED integration by wafer bonding
Presented by Venkata Mokkapati - EV Group
13:25 Germicidal Radiation from UV-C LEDs – The first applications to address and the building blocks for the future
Presented by Alexander Wilm - OSRAM Opto Semiconductors
13:40 PVD Technology for Effective GaN device Metallization
Presented by Clemens Nyffeler - Evatec
13:55 5G Innovation for the Mobile Data Pyramid
Presented by Ben Thomas - Qorvo
14:10 COVID-19’s pandemic - The spark for UVC LEDs’ market ramp-up!
Presented by Pars Mukish - Yole Développement
14:25 NPQD Color Conversion Technology for Mini/Micro-LEDs
Presented by Chen Chen - Saphlux
14:40 Gallium Nitride Epitaxy for Power Electronics Devices
Presented by Heather Splawn - Kymatech
14:55 Disrupting the tubes market with high-voltage GaN HEMTs
Presented by Gabriele Formicone - Integra Technologies
15:10 VCSELs on large area Germanium substrates for volume manufacture
Presented by Andrew Johnson - IQE
15:25 Closing Remarks
Presentation times and order are subject to change. This agenda was last updated on 19 Apr 2021 at 3:53am.
Monday 12th April 2021 starting at 09:00 BST
09:00 Exhibition Opens and Live Networking Room
10:00 Opening Remarks - Professor Michael Lebby, Jose Pozo and Ana Gonzalez
10:05 Quantum Dots based lasers for uncooled operation.
Presented by Alexey Shkolnik - Innolume
10:15 Fireside Chat with Alexey Shkolnik, Innolume, Professor Michael Lebby, Jose Pozo, Director of Technology & Innovation, EPIC, Ana Gonzalez, R & D Manager, EPIC
10:30 Photonic integrated platform for enabling 5G mass deployment.
Presented by Francisco Rodrigues - PICAdvanced
10:45 Utilizing Nanoimprint Lithography for Photonic Integration
Presented by Martin Eibelhuber - EV Group
11:00 Polymers for Fiber Optic Communications: What does the Integrated Photonics Roadmap Say?
Presented by Michael Lebby - Lightwave Logic Inc
11:15 The benefits of Silicon Nitride Integrated Photonics
Presented by Douwe Geuzebroek - LioniX
11:30 Pockels-enhanced silicon photonics
Presented by Stefan Abel - Lumiphase
11:45 Photonic integration testing: challenges and solutions
Presented by Jose Galan - VLC Photonics
12:00 SESSION BREAK
12:45 Low loss PICs that make an impact
Presented by Michael Geiselmann - LIGENTEC
13:00 Unleashing the power of silicon nitride photonics
Presented by Amin Abbasi - imec
13:20 Fabrication tolerance-aware schematic-driven PIC design
Presented by André Richter - VPIphotonics
13:35 The ioNext PIC platform: simplicity is elegance
Presented by Adrien Billat - Teem Photonics
13:50 Solid-state 1550nm FMCW LiDAR. How photonic integration enables the next generation LiDAR
Presented by Davide Canavesi - Scantinel Photonics
14:05 Enhancing EPDA tools with SPICE native optical models
Presented by Cem Bonfil - Optiwave
14:20 Advanced VCSEL PIC technology and applications
Presented by David Cheskis - Lumentum
14:35 Optical I/O for Next-Generation Computing Systems
Presented by Mark Wade - Ayar Labs
14:50 The JePPIX Pilot Line for indium phosphide photonic integration
Presented by Martijn Heck - JePPIX Pilot Line
15:05 Chairs Fireside chat with Anthony Yu, Vice President, Computing and Wired Infrastructure Business Unit
15:25 CLOSING REMARKS
Presentation times and order are subject to change. This agenda was last updated on 19 Apr 2021 at 3:53am.

Partners

DIAMOND

PLATINUM

GOLD

MEDIA PARTNERS

Become an Event Partner

Acquire GDPR-compliant leads for the event before, during and on-demand.
AngelTech LIVE in May and November 2020 attracted 1,500 delegates. The list is provided in advance to sponsors and is updated as and when new registrations come in.
Seamlessly interact with delegates through live chat, email, the enhanced networking portal and much more!
As the event is hosted on demand for 3 months, you can continually grow your leads after the live show.
Showcase a variety of marketing materials, from videos and product demos to technical documents and twitter feeds. Attendees can chat to you via our easy-to-use live chat interface. Keeping track of your visitors is easy with our advanced reports, which can be generated at any time on-demand. See who’s been visiting your booth, and target those who watch or click on specific assets.
Full screen sponsor adverts will appear thanking sponsors during breaks, and for intermissions, rotating between all sponsors.