VCSELs are now key optical sources in gigabit ethernet, high-speed optical-area networks, and computer links because of the advantages they offer, such as low threshold current and a small structure. During conventional dicing of VCSELs fabricated on gallium-arsenide (GaAs) substrates, GaAs wafers are fragile and chipping or edge cracks can easily occur. Panasonic proposes Plasma Dicing as a new wafer singulation method. The plasma dicing process is a technology to dice the entire wafer into chips at once. It is damage free and increases yield. In this presentation, Panasonic explains how Plasma Dicing can be applied to dicing GaAs VCSELs.
Akihiro Itou is a staff engineer at Panasonic Smart Factory Solutions, currently involved in the development of plasma dicing equipment and processes. In 2001, he joined Matsushita Electric Industrial Co., Ltd. (now, Panasonic Co., Ltd.). Since then, he has been engaged in R&D activities and worked in development of Fiber Bragg Grating processes for ultra high speed optical fiber communication and photovoltaic device processes for concentrator photovoltaics. He received a M.S. degree in material physics from Osaka University, Japan.