5G wireless communications, electric vehicles, and advanced automotive lighting applications offer many opportunities for compound semiconductor devices. Whether the application requires power diodes, high frequency transistors, or laser chips, high quality and high throughput MOCVD processes are essential. Taiyo Nippon Sanso Corporation (TNSC) was the first to develop MOCVD equipment in 1983 and has developed many innovations that allow for fast growth of thick, high quality (Al,In)GaN films, which in turn enable high throughput cost effective MOCVD processes. This presentation will highlight key advantages of TNSC’s MOCVD equipment and TNSC’s full-end to end solution for compound semiconductor manufacturers.
Dr. Mayank Bulsara is Vice President, Global Innovation, for Taiyo Nippon Sanso Corporation (TNSC). Dr. Bulsara develops and implements TNSC’s open innovation strategies for TNSC’s advanced technology portfolio, which includes Electronics, Additive Manufacturing, and Medical/Biotechnology. As part of his mission, Dr. Bulsara promotes TNSC’s MOCVD product line and related technologies outside of Japan and actively seeks partnerships to broaden and speed the impact of TNSC’s advanced technology initiatives. Prior to this role, Dr. Bulsara was Chief Scientist of SunEdison Semiconductor. Dr. Bulsara received his Ph.D. in Materials Science from MIT and his B.S. in Ceramic Engineering from Rutgers University.