Joining different semiconductor materials can be challenging due to mismatched material properties as e.g. the coefficient of thermal expansion or lattice structure. Wafer bonding has proven to be a viable way to combine various materials by using interlayers like polymers or metals as well as by direct bonding. However, for compound semiconductors also the form factor is often a crucial barrier. To this end beneficial performance characteristics mostly integrated on system-level but not on wafer level. Recent developments have proven that wafer level die bonding can provide a technically and commercially very attractive solution to this challenge. It combines the benefits of two worlds in terms of flexibility and process control while being scalable to high volume manufacturing.
Dr. Thomas Uhrmann is director of business development at EV Group (EVG) where he is responsible for overseeing all aspects of EVG’s worldwide business development. Specifically, he is focused on 3D integration, MEMS, LEDs and a number of emerging markets. Prior to this role, Uhrmann was business development manager for 3D and Advanced Packaging as well as Compound Semiconductors and Si-based Power Devices at EV Group. He holds an engineering degree in mechatronics from the University of Applied Sciences in Regensburg and a PhD in semiconductor physics from Vienna University of Technology.