Developing and marketing a product based on a photonic integrated circuit is still a challenging task. While the technology has greatly matured in the last decade, allowing to easily prototype PICs using different software tools, material platforms, foundry processes, multi-project wafers, etc. there are still many challenges when moving these prototypes into a commercial product. This presentation will discuss topics like variations and optimizations towards a design freeze, validated design re-use, standardization and automation on die and wafer level opto-electronic testing, and assembly qualification.
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