Infinera in partnership with AIM Photonics developed a “turn-key” InP photonic integrated circuit (PIC) foundry capability that addresses key scale-up challenges to transition from PIC prototypes to high-volume manufacturing. The turn-key foundry capability was developed leveraging best practices embodied in the design and fabrication of commercially deployed monolithically integrated coherent optical communication system on chip (SoC). Various commercial electronic and photonic design automation (EPDA) platforms were customized to provide the scalability necessary to bring an InP-based foundry process into manufacturing. Examples of the electronic photonic design automation tools corroborated with experimental PIC results will be discussed.
Dr. Gloria E. Hoefler holds Ph.D. M.S. and B.S. degrees in Electrical Engineering from the University of Illinois at Urbana-Champaign. She worked at 3M’s Corporate Research Laboratories, HP’s Optoelectronic Division, LumiLeds Lighting, Agilent Technologies, Corning and Infinera in research and development as well as high-volume manufacturing of semiconductor materials, optoelectronic devices and photonic integration platforms. Dr. Hoeffler has co-authored over 70 peer-reviewed and invited papers and holds multiple patents in the area of optoelectronic devices. She is an SPIE Fellow and an IEEE Sr. member and Associate Editor of IEEE IEEE Transactions on Semiconductor Manufacturing. Currently, she is Director of Advanced Development at Infinera working on photonic integrated circuits and photonic integration platforms.