More and more applications benefit from using Photonic Integrated Circuits (PICs), for lowering size and price and for increasing robustness of the system. Several PIC technologies are available, each targeting specific specifications. We demonstrate that for successful product development and scalable production volumes, more than the chip itself needs to be addressed. As different PIC technologies as well as different interfaces need to work together a system level approach to PIC design is needed. LioniX Internationals vertical integrated approach of hybridly combining different chips is essential for that. In this presentation we will highlight this by showing examples of functional modules that show the added value of multi PIC assembled modules.
Arne Leinse Ph.D (CEO) is active in integrated optics for more than 15 years. He received a PhD degree from the University of Twente in the integrated Optical Microsystems group in 2005. Hereafter he joined LioniX BV where he was involved in the invention and development of the TriPleX™ platform from the beginning. He has been involved from the original concept until the exploitation and (co)authored over 100 articles in the last years. He has been Vice-President of LioniX BV and since the establishment of LioniX-international in 2016 became the Chief Commercial Officer. As of January 1st, 2020, he became CEO of LioniX International.