This talk will give an overview of photonic and electronic packaging technologies, and how these technologies are now being brought to commercialisation through a large-scale Pilot Line funded by the European Commission. Called PIXAPP, the Pilot Line provides users with a wide range of advanced photonic and electronic packaging technologies, with the ability to scale manufacturing to medium volumes. PIXAPP is strongly focused on offering standardised packaging technologies, and is working with its global partners to establish a detailed set of packaging design rules and technology roadmap.
Prof. Peter O’Brien is Director of the PIXAPP Photonics Packaging Pilot Line and head of the Photonics Packaging Group at the Tyndall Institute. He is also a lead partner in the InP Pilot Line (InPulse), SiN-PIC Pilot Line (PIX4LIFE) and is a member of ACTPHAST TCT team, JEPPIX and ePIXfab steering committees. His group develops photonic microsystems for high-speed fiber optic communication, medical devices and sensing applications. He previously founded a start-up company manufacturing specialty photonic system for bio-imaging, which he sold in 2009.