The increasing demand for network bandwidth in data centers has resulted in the high volume deployment of pluggable optical transceiver modules with increasing electrical line rates and aggregate module bandwidths. As data rates continue to increase, a much tighter integration of optics and electronics, also known as optical I/O, is becoming necessary. We will discuss recent advances in co-packaging of photonic engines with a high bandwidth ethernet switch (CPO) and the roadmap for deploying products based on such an approach. Deployments at scale require wafer level fabrication processes to manufacture photonic ICs with a high density of integrated lasers, 2.5/3D packaging to integrate multiple electrical and photonic ICs, and appropriate system level thermal and mechanical solutions.
Priyanka Dobriyal, a Technical Program Manager (TPM) with Intel Corporation’s Silicon Photonics Product Division (SPPD), is responsible for the execution of 100G and 400G optical transceivers programs delivering transformational solutions for Data centers. Priyanka joined Intel in 2009 as a Process Engineer after completing her Ph. D from the University of Massachusetts, Amherst in Polymer Physics. She has a MS in Chemistry from Indian Institute of Technology Roorkee. Priyanka is known in the industry for innovations through her publications (>10 Intel and external), technical and non-technical conference presentations and advocating for a diverse and an inclusive culture. She has 6 approved patent filings. In her spare time, Priyanka balances her fast-paced career with dedicated and heart-felt community service by organizing STEM outreach events.