Lumentum introduced the first GaAs VCSEL products for high volume consumer products in 2017 using a scalable, 6-inch manufacturing platform. Since then, billions of VCSELs have been shipped worldwide driven by trends such as the introduction of proximity sensing and 3D facial-recognition technology in consumer smartphones. New applications are emerging today – such as LiDAR for automotive and non-automotive applications, mixed reality, and advanced sensing – that require advanced VCSEL technologies. These new technologies build new features onto the existing manufacturing platform that enable highly integrated VCSEL products – new VCSEL PICs. This talk will present advances in VCSEL PIC manufacturing and discuss new applications that are driving the adoption.
David Cheskis, PhD, serves as the 3D Sensing Product Line Director at Lumentum where he is responsible for new sensing products. Dr. Cheskis is an expert in semiconductor, optoelectronics and communications technologies, products and markets and started the first 6-inch GaAs VCSEL wafer foundry business in 2013. Since 1996, Dr. Cheskis has led the development of semiconductor and optical technologies and products for wireless, wireline and optical products at diverse sensing and communications companies including LeddarTech, IQE plc, II-VI Incorporated, ANADIGICS Inc, Oclaro Inc., Sarnoff Corporation, Jazz Semiconductor, Multilink Technology Corporation, and Vitesse Semiconductor. Dr. Cheskis earned PhD and MS degrees in Electrical Engineering from the University of California, San Diego and a BSEE degree in Microelectronic Engineering from Rochester Institute of Technology. He is a Senior Member of the IEEE.