In advanced technology nodes, as fatal defects that impact product yield become increasingly evident at smaller geometric sizes, the need for wafer cleaning has become even more necessary—and also more challenging. This presentation will discuss how to achieve efficient and effective cleaning that is damage-free and can improve product yield while saving production cost.
CEO and President of ACM Research, Inc.David Wang is ACM’s founder and has served as Chief Executive Officer and President and also as a company director since January 1998. Dr. Wang received a Ph.D. and Master of Engineering in Precision Engineering from Osaka University and a Bachelor of Science in Precision Instruments from Tsinghua University. He is the inventor of stress-free Cu polishing technology, and he holds more than 100 patents in semiconductor equipment and process technology. Dr. Wang brings extensive experience in semiconductor equipment, manufacturing processes and markets from his many years of leadership in the industry.