After a short introduction on the time proven and versatile ion-exchange waveguide technology, which has been the core expertise of Teem Photonics for over 20 years, we will review the latest development on our glass-based PIC platform (ioNext). Those include the release of our first Process Design Kit, comprising a range of passive on-chip functions for coupling, filtering or surface sensing, and our recent results on highly customized AWG manufacturing. We will also cover topics such as interposers for silicon photonics packaging as well as wafer-level probing of edge-coupled PICs. Finally, we’ll go briefly through Teem’s Erbium-doped PIC offering.
Adrien graduated from EPFL (Lausanne, Switzerland) with a PhD in Electrical Engineering in 2017, where he studied nonlinear effects in optical fibers and integrated waveguides. He then went on to work on CERN's optical network. He subsequently joined Teem Photonics in 2018 to work in the Q-switch laser business line, after which he joined the ioNext team in 2019, first in charge of industrialization, and then of business development and application.