Photonic integrated circuits (PICs) have traditionally focused on enabling new devices based on standard CMOS processes, which is particularly true for silicon photonics and datacom applications. However, optical sensors needing more flexibility to pattern the optical elements have explored alternative patterning technologies such as wafer-level optics and nanoimprint lithography. Both technologies can bring benefits to PICs as well as enable more cost-efficient photonic packaging or new product designs.
Martin Eibelhuber is deputy head of business development at EV Group, where he focuses on the application of EVG’s wafer bonding, mask alignment and nanoimprint lithography technology to a variety of markets, particularly compound semiconductors, nanotechnology and photonics. He holds a PhD (Dr. techn.) in technical physics with an emphasis on nanoscience and semiconductor physics from the Johannes Kepler University Linz in Austria. As a university staff member, he gained professional experience in photonics, nanofabrication and material characterization.