Photonic integrated circuits (PICs) are not as mature as electronic circuits. Thus, it is still critical to do extensive component and circuit characterization not only at the prototype phase but also in mass production. We review the main challenges of PIC characterization and testing, as well as we propose automated solutions for die and wafer level testing of PICs. Moreover, we present standard test assembly solutions to enable more affordable PIC testing to any market application.
Obtained the MSc in Telecom Engineering at the Universidad Politécnica de Valencia (Valencia, Spain) in 2006, and received his PhD in Silicon Photonics at the Universidad Politécnica de Valencia (Valencia, Spain) in collaboration with the Technical University of Berlin and Fraunhofer IZM (Berlin, Germany) in 2010. He has worked as Project Manager, Presales Manager and Key Account Manager for several electronic and optical equipment manufacturer companies, mostly in telecom and automotive sectors. He holds specializations in Business Administration and Digital Marketing. Since 2021, he is Sales and Marketing Manager of VLC Photonics, a company from Hitachi High-Tech.